Molybdenum Copper Alloys

Thin Molybdenum-Copper (MoCu) Alloy Sheet (0.25mm x 200mm x 300mm)

This thin Molybdenum-Copper (MoCu) alloy sheet is made possible by the excellent rollability of our MoCu composite material. At just 0.25mm thick, it is an ideal Heat Sink Material for applications requiring a lightweight, low-profile thermal spreader. It combines good planar thermal conductivity with a low CTE, making it a superior alternative to copper foils in applications where thermal stress is a concern in Electronics Packaging.

Technical Specifications

Product Images and Videos

Product Features and Advantages

Ultra-Thin Profile

The 0.25mm thickness allows for heat spreading in extremely space-constrained environments, such as portable electronics and compact power modules.

Superior to Copper Foil

While copper foil has high conductivity, its high CTE can cause stress and warping when bonded to low-expansion materials like silicon or ceramics. This MoCu sheet provides a low-CTE alternative, ensuring mechanical stability.

Excellent Formability

Due to its good ductility, this thin sheet can be stamped or formed into shims, lids, or other custom shapes, offering great design flexibility for Optoelectronic Packaging.

Application Scenarios

• Thermal Interface Material (TIM) Enhancement: Used as a heat spreader on top of a CPU or GPU to improve heat transfer to a larger heat sink.
• Power Device Substrates: A thin base layer for mounting power devices onto a larger cooling plate.
• Package Lids: Can be stamped and formed into lids for hermetically sealed Ceramic Packages.
• Battery Cooling: Thin heat spreaders for managing thermal loads in battery packs.

Benefits for Customers

• Solve Space-Constrained Thermal Problems: Add effective heat spreading with minimal impact on the Z-height of your assembly.
• Improve Reliability: Prevent stress-related failures that can occur when using high-CTE materials like copper or aluminum foils.
• Enable Lightweight Designs: The low density of MoCu combined with the thin profile provides an excellent heat-spreading-to-weight ratio.

Certifications and Compliance

All our materials are produced in our ISO 9001:2015 certified facility, ensuring the highest standards of quality and consistency.

Customization Options

We can provide thin MoCu sheets in custom widths, lengths, and thicknesses. We also offer stamping and plating services to deliver a finished part to your specifications.

Production Process and Quality Control

Our process involves synthesizing the MoCu material, followed by a specialized multi-stage rolling and annealing process to achieve the final thin gauge while maintaining material integrity. Every coil or sheet is inspected for thickness uniformity and surface quality.

Customer Testimonials and Reviews

"This thin MoCu sheet was the perfect solution for our compact power module. It spreads the heat effectively without adding bulk, and its low CTE prevented the substrate from warping. A fantastic product." - Senior Engineer, Power Electronics Firm

FAQ

Q1: How does the thermal conductivity of this thin sheet compare to a solid block of the same material?

A1: The rolling process can sometimes align the material grains, which may slightly alter the in-plane vs. through-plane conductivity. However, for heat spreading applications, the in-plane conductivity remains excellent and far superior to that of many other thin thermal materials.

Q2: Can this sheet be soldered?

A2: Yes, but like any MoCu product, it requires plating (e.g., Ni/Au or Ni/Ag) for reliable soldering. We can provide the sheet with the appropriate plating for your assembly process.