Aluminum Nitride Ceramic Substrate for Electronic Packaging

Aluminum Nitride Ceramic Substrate

Puwei's Aluminum Nitride (AlN) Ceramic Substrates represent the pinnacle of thermal management solutions for advanced electronic applications. Manufactured using precision casting processes, these substrates are engineered to meet the demanding requirements of modern electronic packaging and microelectronics packaging applications.

Our specialized subdivision of aluminum nitride substrates addresses diverse customer requirements, particularly focusing on optimized metallization solutions for various applications. With exceptional thermal conductivity and electrical insulation properties, these substrates serve as fundamental components in high-performance electronic systems.

Product Advantages

• Vertical Integration: Complete quality control from raw material development to finished ceramic products, ensuring consistent performance and reliability
• Superior Thermal Management: Standard thermal conductivity ≥ 175W/m·K, with premium options reaching ≥ 200W/m·K for demanding applications
• Comprehensive Customization: Tailored solutions including grinding type, instant burning type, high bending resistance variants, high thermal conductivity options, polishing type, and laser marking compatible substrates
• Versatile Metallization Compatibility: Supports various metallization techniques including DPC, DBC, TPC, AMB, thick film printing, and thin film printing
• Ultra-Thin Configurations: Minimum thickness capabilities down to 0.10mm for space-constrained applications

Technical Specifications

Our Aluminum Nitride Ceramic Substrates exhibit exceptional performance characteristics ideal for power devices and high-power microelectronic components. The material demonstrates outstanding thermal conductivity exceeding 175W/m·K, with high-performance variants reaching 200W/m·K. Electrical insulation properties ensure reliable operation in high-voltage environments, while the coefficient of thermal expansion closely matches silicon, minimizing thermal stress in semiconductor applications.

Mechanical properties include high flexural strength exceeding 300MPa, ensuring structural integrity in demanding operational conditions. Surface roughness can be precision-controlled to sub-micron levels, critical for thin film resistor elements and advanced hybrid micro circuits. The substrates maintain excellent performance across a wide temperature range from -50°C to 400°C, with dielectric strength greater than 15kV/mm.

Product Features & Competitive Advantages

Advanced Thermal Management

The exceptional thermal conductivity of our Aluminum Nitride substrates enables efficient heat dissipation in high-density integrated circuits and power electronic systems, significantly enhancing device reliability and lifespan.

Customized Metallization Solutions

We provide specialized metallization services optimized for specific application requirements, including direct plate copper (DPC), direct bonded copper (DBC), thick film and thin film printing processes. This versatility makes our substrates ideal for RF circuits and microwave components.

Precision Manufacturing

Utilizing advanced casting technology, we achieve exceptional dimensional accuracy and surface quality, critical for thermoelectric semiconductor module plates and precision ceramic components.

Production Dimensions & Capabilities

Our manufacturing facilities support a wide range of substrate dimensions tailored to specific application needs. Standard thickness ranges from 0.10mm to 1.5mm, with custom thickness options available. Panel sizes can be customized up to 150mm × 200mm, accommodating various production requirements for sensor packaging and optoelectronics applications.

Application Scenarios

Electronic Power Systems

Ideal for insulation elements in high-power converters and inverters, providing excellent electrical isolation and thermal management for power semiconductor devices.

High-Frequency Electronics

Superior performance in high-frequency modules and microwave applications due to low dielectric loss and stable electrical characteristics across frequency spectra.

Advanced Packaging Solutions

Critical component in microelectronics packaging and sensor packaging, enabling miniaturization while maintaining thermal performance and reliability.

Optoelectronic Systems

Excellent substrate choice for optoelectronics applications, particularly in high-power LED systems and laser diodes where efficient heat dissipation is crucial.

Implementation Guidelines

1. Design Phase: Consult our technical team for substrate specification based on thermal, mechanical, and electrical requirements
2. Metallization Selection: Choose appropriate metallization method (DPC, DBC, thick film, etc.) based on application needs
3. Mounting Preparation: Ensure proper surface preparation for component attachment and interconnection
4. Thermal Management Integration: Incorporate into system thermal design considering the substrate's exceptional thermal properties
5. Quality Verification: Implement standard testing protocols for thermal performance, electrical isolation, and mechanical integrity

Value for Procurement Professionals

Puwei's Aluminum Nitride Ceramic Substrates deliver significant operational advantages including extended component lifespan through superior thermal management, reduced system failure rates in demanding environments, and enhanced performance consistency in high-power microelectronic components. The substrates contribute to overall system cost reduction by enabling higher power densities and simplifying thermal management systems.

Customization Capabilities

We offer extensive customization options including dimensional specifications, surface finish requirements, specialized metallization patterns, and tailored thermal performance characteristics. Our engineering team collaborates closely with clients to develop optimized solutions for specific applications in thermoelectric cooling assemblies and specialized ceramic chips.

Manufacturing Excellence

Our production process integrates rigorous quality control at each manufacturing stage, from raw material selection through final inspection. Advanced casting technology ensures consistent material properties and dimensional accuracy, while specialized firing processes optimize the ceramic microstructure for enhanced thermal and mechanical performance in critical applications such as thick film hybrid microcircuits.

In addition to Aluminum Nitride substrates, Puwei provides comprehensive advanced ceramic solutions including alumina ceramics, silicon carbide ceramics, silicon nitride ceramics, and specialized ceramic metallization materials. This diverse portfolio enables us to offer optimal material selection for specific application requirements across thermal management, electrical insulation, and mechanical support functions.