Packages for Wireless Communications
3 year ago
Flanged Power Packages for High-Power RF Transistors
Product Overview
Our flanged power packages are industry-standard solutions for housing high-power RF transistors used in demanding applications like wireless base stations and radar systems. This style of Wireless RF Packaging features a robust metal flange for secure mounting to a heat sink, a high-conductivity base for thermal management, and isolated leads passing through a ceramic frame. This construction provides excellent heat dissipation, mechanical stability, and reliable electrical connections for high-power LDMOS and GaN transistors. It is a proven, cost-effective, and high-performance solution for RF power amplifier designers.
Technical Specifications
| Parameter | Specification (Example: QF193 / 780-2 Style) |
|---|---|
| Outer Dimensions | 20.57 x 9.78 x 1.67 mm |
| Cavity Dimensions | 16.51 x 6.10 x 0.50 mm |
| Lead Count | 2 (plus source flange) |
| Base Material | Options include Copper (TU1), WCu, MoCu |
| Ceramic Frame | High-purity Alumina ($Al_2O_3$) |
| Leads | Kovar (4J34) |
| Power Handling | Up to 500W (pulsed) depending on design and semiconductor |
| Frequency Range | Suitable for applications up to S-Band (~3 GHz) |
Product Images
Features & Advantages
- Efficient Thermal Transfer: The large metal flange provides a direct, low-resistance path to the system heat sink, ensuring the transistor junction stays cool.
- Robust Mechanical Mounting: The bolt-down flange design creates a secure and reliable mechanical connection, resistant to shock and vibration.
- Industry-Standard Footprints: We offer a wide range of packages in industry-standard outlines (e.g., 360-2, 400-2, 780-2, 1230-4) for drop-in replacement and design compatibility.[1]
- Proven Reliability: This package style has a long history of reliable performance in the telecommunications and aerospace industries.
- Cost-Effective Solution: A mature design and manufacturing process make this a highly cost-effective choice for high-power Electronics Packaging.
Application Scenarios
These flanged packages are ubiquitous in the RF power industry and are used in:
- Macro base station power amplifiers for 4G/LTE networks
- Broadcast transmitters for TV and radio
- Avionics transponders and communication systems
- Industrial, Scientific, and Medical (ISM) band equipment
Benefits for Customers
- Design with Confidence: Use a proven, industry-standard package that simplifies your thermal and mechanical design.
- Ensure Product Reliability: The robust construction and efficient cooling contribute directly to a longer-lasting, more reliable power amplifier.
- Access a Wide Portfolio: Choose from dozens of standard package outlines to find the perfect fit for your transistor and application.
- Optimize for Performance: Our packages are designed for low thermal resistance and good electrical performance, helping you get the most out of your power transistor.
FAQ (Frequently Asked Questions)
Q1: What is the purpose of the ceramic frame in the package?
A1: The ceramic frame (typically Alumina) is an excellent electrical insulator. It allows the metal leads (Gate and Drain) to pass into the package and connect to the transistor die while remaining electrically isolated from the metal flange, which is typically connected to the Source of the transistor and ground.
Q2: Are these packages hermetically sealed?
A2: These types of RF power packages are typically non-hermetic. They are sealed with an epoxy or ceramic lid that provides mechanical and environmental protection but is not airtight. This is a standard and highly reliable approach for most wireless infrastructure applications.
Q3: Can you produce a custom footprint or lead configuration?
A3: Yes. While we offer a vast portfolio of standard packages, we have full custom design and manufacturing capabilities. We can work with you to develop a unique package tailored to your specific needs.
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