Packages for Wireless Communications
3 year ago
Surface Mount (SMD) Power Packages for RF Power Amplifiers
Product Overview
Our Surface Mount Device (SMD) power packages are compact, high-performance solutions designed for modern Wireless RF Packaging. These packages provide excellent thermal dissipation and electrical performance for power transistors in a leadless, surface-mountable form factor. By eliminating traditional leads and utilizing a multi-layer ceramic construction with an integrated metal heat sink, these ceramic packages offer a low-profile design with very low parasitic inductance, making them ideal for high-frequency applications. They are engineered for automated pick-and-place assembly, enabling high-volume, cost-effective manufacturing of RF power amplifiers.
Technical Specifications
| Parameter | Specification |
|---|---|
| Package Series | SMD-0.5, SMD-1.0, and custom sizes |
| Heat Sink Material | Tungsten Copper (WCu), Molybdenum Copper (MoCu), CMC, CPC |
| Ceramic Material | High-purity Alumina ($Al_2O_3$) |
| Electrode Material | Oxygen-Free Copper (TU1) |
| Plating | Nickel (Ni) and Gold (Au) for solderability and wire bonding |
| Assembly Method | Surface Mount Technology (SMT) |
| Compliance Standard | GJB923A-2004 (General specification for packages of semiconductor discrete devices) |
Product Images
Features & Advantages
- Excellent High-Frequency Performance: The leadless design minimizes parasitic inductance and capacitance, resulting in better gain, efficiency, and bandwidth for RF amplifiers.
- Superior Thermal Pathway: The integrated metal heat sink provides a direct, low-resistance thermal path from the transistor die to the PCB, ensuring efficient cooling.
- Designed for Automated Manufacturing: The SMD format is fully compatible with standard SMT assembly lines, reducing manufacturing costs and increasing throughput.
- Compact and Lightweight: The low-profile, leadless design enables higher circuit density and is ideal for space-constrained applications.
- High Reliability: Built with a robust material set that is proven to withstand the thermal and mechanical stresses of assembly and operation.
Production Process Overview
- Ceramic Processing: High-purity alumina ceramic layers are cast, punched, and printed with tungsten metallization.
- Lamination & Co-firing: The ceramic layers are stacked and fired at high temperature to form a monolithic structure.
- Brazing: The metal heat sink and I/O electrodes are brazed to the ceramic body in a controlled atmosphere.
- Plating: The package undergoes electrolytic Nickel and Gold plating for protection and solderability.
- Quality Inspection: 100% visual and dimensional inspection is performed to ensure quality.
Application Scenarios
These SMD packages are the preferred choice for a wide range of modern wireless applications:
- Small cell and remote radio heads for 5G networks
- Portable and mobile radio systems
- Avionics and drone communication links
- RF modules and multi-chip assemblies
FAQ (Frequently Asked Questions)
Q1: What is the main advantage of an SMD package over a traditional flanged package?
A1: The main advantages are size and high-frequency performance. SMD packages are significantly smaller and lighter, and the absence of long leads results in much lower inductance, which is critical for achieving good performance at higher RF frequencies. They are also better suited for high-volume automated assembly.
Q2: How is heat transferred from the SMD package to the system?
A2: The metal heat sink on the bottom of the SMD package is soldered directly to a thermal pad on the printed circuit board (PCB). The PCB then spreads the heat and often transfers it to a larger system-level heat sink or chassis.
Q3: Are these packages available on tape and reel for automated assembly?
A3: Yes, we can provide our SMD electronic packages in tape and reel format to meet the requirements of your high-speed pick-and-place assembly lines. Please specify this requirement when ordering.
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Main Product:
Tungsten Heavy Alloys,
Heat Sink,
Electronic Packaging,
Rhenium Alloys ,
Tantalum Alloys,
Nickel Based Braze Alloy
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