Packages for Integrated Circuits
3 year ago
CLCC-20: 20-Pin Ceramic Leadless Chip Carrier
Product Overview
The CLCC-20 is a 20-terminal Ceramic Leadless Chip Carrier, a high-performance surface-mount package engineered for maximum density and excellent high-frequency performance. By eliminating leads and using metallized terminals on the package body, the CLCC offers the shortest possible signal path from the IC to the PCB, minimizing parasitic inductance. Its monolithic ceramic construction provides superior thermal dissipation and the capability for a true hermetic seal, making it an outstanding choice for demanding applications in aerospace, defense, and telecommunications where performance and reliability are paramount.
Technical Specifications
| Parameter | Specification (Model: LCC20) |
|---|---|
| Terminal Count | 20 |
| Terminal Pitch | 1.27 mm |
| Body Material | Multilayer Alumina (Al₂O₃) Ceramic |
| Terminal Plating | Nickel (Ni) / Gold (Au) for excellent solderability and wire bonding |
| Body Dimensions | SQ 9.0 mm |
| Die Cavity Dimensions | SQ 4.6 mm |
| Sealing Method | Seam Weld (Hermetic) |
| Compliance | Designed to meet MIL-STD-883 reliability standards |
Product Images
Features & Advantages
- Excellent High-Frequency Performance: The leadless design provides extremely low parasitic inductance, making the CLCC ideal for RF, microwave, and high-speed digital circuits.
- Maximum Miniaturization: Offers a very high I/O density for its footprint, enabling significant reductions in PCB size and product weight.
- Superior Thermal Dissipation: The ceramic body provides a highly efficient thermal path from the IC to the PCB, superior to any plastic package.
- Mission-Critical Reliability: The robust, monolithic ceramic construction and hermetic seal provide unparalleled protection for sensitive ICs in harsh environments.
Application Scenarios
The CLCC-20 is a versatile solution for a range of high-performance electronics:
- Wireless Communications: RFICs, MMICs, and other components in Wireless RF Packaging for portable radios and base stations.
- Aerospace & Defense: High-speed digital processors and sensors where size, weight, and reliability are critical.
- Medical Devices: Implantable and diagnostic equipment requiring compact and reliable electronic packages.
Benefits for Customers
- Boost Performance: Enable your high-speed and RF circuits to operate at their full potential.
- Shrink Your Product: Dramatically reduce the size and weight of your electronic assemblies.
- Increase Reliability: Protect your valuable ICs from environmental threats and thermal stress with a hermetic solution.
FAQ (Frequently Asked Questions)
Q1: What is the main challenge when soldering CLCC packages?
A1: The primary challenge is managing the thermo-mechanical stress caused by the mismatch in the Coefficient of Thermal Expansion (CTE) between the ceramic package and the PCB. For reliable, long-term solder joints, it is crucial to use a PCB material with a compatible CTE or employ other stress-mitigation techniques in your assembly.
Q2: Can CLCCs have a thermal pad on the bottom?
A2: Yes. Many CLCC designs can incorporate a large, metallized ground/thermal pad on the bottom of the package. This pad can be soldered directly to the PCB to create an excellent, low-resistance thermal path for high-power devices.
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