Packages for Integrated Circuits
3 year ago
CSOP-48: 48-Lead Ceramic Small Outline Package
Product Overview
The CSOP-48 is a high-pin-count, 48-lead Ceramic Small Outline Package designed for complex integrated circuits that require both a compact surface-mount footprint and high reliability. This package provides a hermetically sealed environment, superior thermal performance, and robust mechanical construction, making it an ideal choice for advanced ICs in demanding sectors such as telecommunications, industrial automation, and aerospace. It is a significant reliability upgrade over comparable plastic packages like SSOP or TSSOP.
Technical Specifications
| Parameter | Specification (Model: CSOP48E) |
|---|---|
| Lead Count | 48 |
| Lead Pitch | 0.5 mm |
| Body Material | Multilayer Alumina (Al₂O₃) Ceramic |
| Lead Material / Finish | Kovar / Gold (Au) over Nickel (Ni) |
| Die Cavity Dimensions (A x B) | 5.50 mm x 5.20 mm |
| Overall Dimensions (C x D) | 12.56 mm x 7.82 mm |
| Sealing Method | Au-Sn Solder Seal (Hermetic) |
| Compliance | Designed to meet MIL-STD-883 reliability standards |
Product Images
Features & Advantages
- High-Density SMT Design: The fine 0.5mm pitch allows for a high pin count in a compact surface-mount footprint, enabling complex functionality in a small area.
- Hermetic Protection: The hermetically sealed ceramic body provides the ultimate protection for sensitive ICs against moisture and contaminants.
- Reliable Solder Joints: Compliant gull-wing leads absorb thermo-mechanical stress, ensuring long-term solder joint integrity.
- Excellent Thermal Properties: The ceramic construction offers superior heat dissipation compared to plastic packages, ensuring stable device operation.
Application Scenarios
The CSOP-48 is ideal for a wide range of complex ICs:
- Telecommunications: Driver and controller ICs for Optoelectronic Packaging.
- Industrial Automation: Multi-channel data acquisition systems, motor controllers, and complex sensor interfaces.
- Aerospace & Defense: Custom ASICs and FPGAs requiring high reliability.
Benefits for Customers
- Enable Complex Designs: House sophisticated, high-pin-count ICs in a compact and reliable SMT package.
- Guarantee Long-Term Reliability: Protect your valuable ICs from environmental failure modes with a hermetic solution.
- Optimize for Manufacturing: Use a package designed for efficient, high-volume automated SMT assembly.
FAQ (Frequently Asked Questions)
Q1: What is the benefit of a CSOP-48 over a CQFP-48 (Ceramic Quad Flat Pack)?
A1: The main difference is the lead configuration. A CSOP has leads on two sides, while a CQFP has leads on all four sides. For a 48-pin device, a CQFP will have a more square, compact body, while a CSOP will be longer and narrower. The choice often depends on the specific PCB layout and routing requirements.
Q2: What is Au-Sn solder sealing?
A2: Au-Sn (Gold-Tin) solder sealing is a high-reliability hermetic sealing process. A lid with a pre-applied Au-Sn solder preform is placed on the package's seal ring and heated in a controlled atmosphere furnace. The solder melts and creates a strong, reliable, hermetic seal.
Similar Video Recommendation
You May Also Like
If you are interested in the product, contact Bossgoovideo.com for more information
- *To:
- Shaanxi Xinlong Metal Electro-mechanical Co., Ltd.
- *Message:
-
Submit
Main Product:
Tungsten Heavy Alloys ,
Heat Sink,
Electronic Packaging,
Rhenium Alloys,
Tantalum Alloys,
Nickel Based Braze Alloy
You May Also Like